PRECISION INSTRUMENTS / SINCE 2005400-8127-833

APPLICATION WORKFLOW

Sampling cracks and fracture-related defects

Preserve the features needed for defect examination and traceable image records.

01Preserve the defect and adjac…02Record position and orientati…03Mount and polish when appropr…04Examine defect features first05Save images with locations
Process overview: advance step by step and confirm each stage before moving on.
Preserve the defect and adjacent structure
Record position and orientation
Mount and polish when appropriate
Examine defect features first
Save images with locations

Application example for discussing a method. This is not a customer test report or a fixed recipe. Confirm conditions, methods and acceptance requirements before use.

  1. Preserve the defect and adjacent structure

    Take a specimen containing the relevant fracture or crack section without damaging the feature during preparation.

  2. Record position and orientation

    Document sampling location, specimen count and the intended examination plane.

  3. Mount and polish when appropriate

    Support small or irregular samples and prepare the target surface.

  4. Examine defect features first

    Arrange pre-etch examination of inclusions, cracks, pores or coatings as required. Use a suitable separate procedure for microstructure.

  5. Save images with locations

    Select fields that address the inspection objective and retain the corresponding image records.

Instrument references

Records to retain

  • Specimen ID, material, sampling position and orientation.
  • Instrument model, consumable batch, actual settings and operator.
  • Surface condition, observations and corrective actions at each stage.
  • Images, raw measurements and the method version used.

Interpreting results

Evaluate results against the agreed method and acceptance requirements. No measured outcomes or customer results are asserted by this example.

Source reference www.cnnoet.com ↗ · Compiled from public references; see the source link

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